PCB Fiberglass Copper Clad FR4 Circuit Board (Single-Sided)

Key Features of FR4 PCB Boards:

1. Fiberglass Composite (FR4):

   • FR4 is a flame-retardant composite material that consists of fiberglass (woven cloth) impregnated with an epoxy resin.
   • The fiberglass adds strength and durability, while the epoxy resin provides electrical insulation and thermal stability.

2. Copper Clad:

   • The copper layer is laminated onto the FR4 board, and it serves as the electrical conducting layer.
   • Copper thickness typically varies from 1 oz/ft² to 3 oz/ft², which affects the current-carrying capacity and signal integrity.

3. Electrical Insulation:

   • High insulation resistance prevents electrical leakage between traces, ensuring proper functionality of the circuit.
   • High dielectric strength allows for reliable performance at higher voltages.

4. High Thermal Stability:

   • FR4 is capable of withstanding high temperatures, making it ideal for high-frequency applications and those with significant power dissipation.
   • It is often rated for use in temperature ranges of -40°C to +130°C.

5. Mechanical Strength:

   • Offers high mechanical strength, making the board resistant to physical stress and bending, ensuring its durability during assembly and use.

6. Cost-Effective:

   • FR4 is an affordable material, making it the go-to choice for most consumer and industrial electronics, balancing performance and cost.

7. Versatility:

   • Flexible Design Options: FR4 can be used to make both single-sided and double-sided PCBs and even multilayer boards with complex designs.
   • Ideal for use in SMD (Surface Mount Devices) or through-hole component designs.

8. Good Dimensional Stability:

   • FR4 boards maintain their shape and size even when exposed to heat and humidity, ensuring the circuit’s functionality over time.

9. Etching Process:

   • The copper layer can be etched to create traces and pads for electrical connections. The etching process allows for high-precision circuit designs with fine lines.